广东科杰技术股份有限公司、广东佳铁、雕铣机、精雕机、钻铣中心-j9九游会真人游戏第一

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fly-801 to laser diode wire bonder

featuresparameters

features

- thermosonic high speed bonding, fast conversion

- vision system: programmable look ahead pr

- multiple die and level bonding capability

- rotating platform

- bonding on crossed planes at any angle

 

wire type

au


applied range

optical communications


item

parameter

bonding   technology

thermosonic bonding

optics

single path or double paths (optional)

bonding accuracy

±3.0μm

bonding area

56 x 70mm

cycle time

parallel planes: 60ms/wire

crossed planes: 80ms/wire

wire diameter

17μm-50μm


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